BJ820 thin wire wedge bonder

The German company is one of the world's leading manufacturers of automatic thin or thick wire wedge or ball bonder equipment. Their solutions include software for ultrasonic bonding process monitoring, gripping capabilities and a wide range of automated product handling options. Hesse's installations can be found worldwide in automotive, medical, solar, power electronics, lighting technology or other semiconductor industries.


  • Bond Heads developed by Hesse
  • PiQC (Process integrated Quality control) real-time quality control
  • E-Box ensures reproducibility (wire guide, cutter and wedge adjustment)
  • In-line up to multilane option
  • Filling and filling product containers design
  • MES, SECS/ GEM communication, traceability
  • 1 µm repeatability (3 sigma)
  • Precise bond-force control (1cN)
  • Working area: 305 mm; Y: 410 ; Z: 30 mm
  • 420° rotatable bond head
  • Two types of bondhead BK04 Bondhead 45°, BK04 Bondhead 60° and DA04 Bondhead 90° (Deep Access)
  • Bondable wires:
  • Al, Au: 17.5 µm - 50 µm
  • Cu: 17.5 µm - 30 (50 optionally) µm
  • Tape:
  • Al, Au: 6 µm x 35 µm up to 25 µm x 250 µm
  • Up to 7 wires per second
  • Loop length: 70 µm - 20 mm
  • Different loop-form options
  • Fine pitch < 40 µm

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