CIF VS-500-V
For medium volume production, where inline reflow solutions are not required, vapour phase technology is the right choice. In addition to production, the BGA is also suitable for reflow and adhesive curing tasks. The advantage of the vapour phase technology is that no time-consuming thermal profiling is required, any PCB can be soldered at high quality with low voids. The design of the machine allows soldering of the most complex boards up to 500 x 500 x 60 mm while ensuring optimum quality.