BJ830 thin wire ball wedge bonder
- Details
- Parameters
- 2 µm repeatability (3 sigma)
- Precise bond-force control (1-300 cN)
- Working area: 305 mm; Y: 410 ; Z: 30 mm
- 180° rotatable bond head
- BW01 Ball-Wedge Bondhead
- Precise bond-force control (1-300 cN)
- Bondable wire 17.5 µm - 50 µm
- NEFO rock generator
- Different loop-form options
- Fine pitch