Rehm CondensoXC reflow soldering

Space-saving and powerful

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Introduction

Reflow soldering by condensation

Multi-faceted processes with the Condenso

The reflow soldering field of industry is wide-ranging, whether it’s in aerospace engineering, LED manufacture or power electronics. Electronic components only work in end devices
by soldering electronic contacts in a high-quality fashion. But what happens when components on the circuit board are very large or high-mass? Or if vacuum soldering processes should be implemented inline?
In condensation reflow soldering, or vapour-phase soldering, soldering is accomplished using a hot vapour. To put it in simpler terms: Imagine you have just come from the ski slope
and walk into a warm chalet with cold ski goggles. The goggles fog up instantly. This is called film condensation. You can only see clearly again once the ski goggles have reached
room temperature. Condensation soldering works based on the same principle.
In this case, heat transfer in condensation soldering is up to ten times higher than with convection soldering. This means that even large, high-mass boards can be reliably processed in
a stable atmosphere and with innovative vacuum technology with Rehm’s Condenso series.

Vapour phase soldering

in every manufacturing environment

The Condenso series system versions can be integrated into a wide range of manufacturing environments. Whether it’s a batch operation, inline connection or continuous soldering – Rehm offers the highest degree of process reliability for all areas!
The application options for the Condenso series are as varied as their production. We would be happy to determine the most efficient system for your manufacturing process, taking all relevant processes such as throughput, assembly size, thermal mass and follow-up processes into account.

Details

The Condenso series at a glance
Flexible and adjustable

CondensoXC

Space-saving and powerful

Batch system for low throughput
Used in laboratory applications, small production lines or prototyping

CondensoXS smart

Great performance with a small footprint

Inline ready system for medium throughput
Low space requirements
Ideal for small-series production

CondensoXM smart

All-rounder for electronics production

Inline system for medium throughput
Autom. side Loading/unloading with preassembled carriers
Used for small and medium-sized series

Condenso smartline

Ideal for large series

Inline connection for medium throughput
Automatical loading, internal carrier return transport
Used in series production

CondensoX-Line

Reliable in the through-feed process

Inline system for high throughput
3-chamber system and built-in vacuum soldering
S eries manufacture and power electronics
F ully inert soldering process unter nitrogen

Product options

CondensoXC

Optimal results with the smallest footprint

Small footprint – High performance system for optimum soldering results
Patented injection principle – Reproducible soldering processes thanks to optimum profiling
Galden® cleaning – No spreading of Galden^® and active Galden^® filtering thanks to the Closed Loop Principle

The CondensoXC is a space-saving, powerful system for
laboratory applications, small series production and prototyping. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provides the optimal soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly.
With a footprint of just 2.3 m², this system is specially designed
for small series and is also ideal for prototype production.
As a batch system, it can be used flexibly, irrespective of
the production environment.