Reflow soldering
After the application of solder paste and the placement of components, the next step involves reflowing the solder material, thereby creating micro-bonds.
Click plus to add products and services to compile an interest list to your detailed info request form!
The solder material is essentially re-melted through this process, which is why it is referred to as "reflow" soldering. The primary objective of the reflow process is to ensure high-quality bonding between the components and the appropriate sections of the board.
The reliable bonding achieved through reflow soldering is accomplished by simultaneously heating the board's contacts, leads, and solder paste above the alloy's melting point. This is done in such a way that the soldering transforms into a homogeneous structure. The reliability of the process depends on the effective control of heating and the application of different temperature settings to various panels. This control is referred to as a "thermal profile."