Stencil printing
The solder paste application represents a crucial stage in the manufacturing technology of surface mounting.
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Stencil printing stands out as the most prevalent method for applying solder paste. In the majority of instances, a substantial portion of soldering defects can be traced back to this specific technological step. In the process of stencil printing, solder paste is deposited onto the board's pads through apertures created in a stencil.
The application of paste can occur either in a single phase or two phases. In a single-phase procedure, the blade traverses the stencil once, whereas in a two-phase operation, paste application takes place in both forward and reverse directions. After the paste is deposited onto the pads of the substrate, the board can be advanced manually or, in the case of automated printers, it is automatically transferred to the subsequent workstation along the production line. The quality of the solder paste application is significantly influenced by factors such as the blade type, its velocity, printing angle, board separation speed, etc.