Yamaha YRH10
High precision Hybrid Placer i-Cube10
Introduction
The Yamaha YRH10 hybrid placer utilizes high-precision placement capabilities for the semiconductor industry. This advanced hybrid placer is suitable for placing both semiconductor and SMD components within a single machine cycle. Its conveyor system is optimized to produce so-called ‘module products’. In addition to high precision it also boasts exceptional placement speed. The entire system is designed to continuously adopt temperature variations in the system and environment, thus maintaining high placement accuracy. Its feeder system can handle 6” and 8” wafers, and with additional options, it can even accommodate larger one. The customized pallet storage device is a great help in prototype manufacturing. With automatic nozzle exchange and the use of dual ejector pins, placing multiple die packages in a single cycle is not a challenge.
We recommend our versatile YRH10 system for applications of adhesive dispensing, MEMS or ASIC chip placement, metal cap placement, and power module placement too.
Details
- Intelligent feeder
- Wafer tray
- Inline head with a scan camera
- pickup compensation
- Placer with 10-nozzles on the mounting head
- mounting speed: 10800 UPH
- high mounting accuracy of ±15μm (μ+3σ)
Product options
- Nozzle station
- Blow station
- PCB height measurement laser sensor
- Nozzle height compensation touch sensor
- Multi camera
- Ionizer (tape feeder side and wafer side)
- IT option note
- YSUP programming
- Dipping station
- Wafer mapping (comes with barcode reader)
- Pin sensor
- Machine internal lamp
- Temporary holding station
- Muzzle plate
- QFP recovery conveyor
- Monitor offset
- Reel holder
- Empty tape box
- Flat ring tray
Parameters
- Dimensions: L1,252 x W1,962 x H1,853mm , 1,560kg
- PCB dimensions: L50 x W30 ～ L330 x W250, Height 0.1 ～ 4.0mm
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Product showcase videos
Yamaha YRH10
High precision Hybrid Placer i-Cube10
