MPM Momentum II
A versatile configurable stencil printer
Introduction
The reliable Momentum printer with new features and a new cover: the renewed MPM Momentum II series. MPM is the world leader in high-speed, high-precision solder paste stencil printing equipment. The MPM Momentum II equipment can be configured to meet a wide variety of needs, with models that differ from the basic machine in speed, enclosure size and panel handling capabilities. The most advanced printer options are also available.
Details
- 17 micron accuracy (wet print, >2 Cpk @ 6σ)
- Cycle time up to 6 seconds
- Digital up/down camera
- Vacuum, wet and dry stencil wiping
- Built-in adjustable width stencil holder (23″ – 29″)
- Support positioning software
- Automatic pin support displacement hardware (max. 48 pins)
Product Options
- Edgeloc™ Y-directional panel fixation
- RapidView 2D solder print verification (with paste-bridge recognition)
- Check for stencil clogging
- Feedback of SPI offsets
- PrinTrack – Complete traceability system
- OpenApp via open external software interference with the operation of the printer
- Camalot Inside glue or paste dispenser
- EnclosedFlow closed printhead
- Paste height and paste temperature measurement
- Three-conveyor staged configuration for shorter cycle times
Parameters
- Panel size: min 50.8 mm x 50.8 mm max 609.6 mm x 508 mm
- Panel thickness: 0,2 – 6 mm
- Maximum bottom part size: 12.7 mm (optional 25.4 mm)
- Printable area: 609.6 mm x 508 mm
- Print speed: 305 mm/sec
- Print force: 0-200 N
- Stencil size: max: 737 mm x 737 mm
Image gallery
Product showcase videos
Enclosed flow, the closed printhead
Patented technology up to 50% for less paste consumption.
Auto Tooling store
Automatic support allocation system for quick changeovers without human intervention.
Rapidview inspection
Positioning camera also capable of 2D optical inspection!
Edgeloc
Unique side-panel loading for best paste transfer efficiency and print quality
