Fritsch Reflow ovens
Inline Reflow Oven
Introduction
FRITSCH provides an ideal solution for producing small to medium series with their reflow soldering system.
The reflow-soldering of SMD assembled components and the curing process are easy and economic by the use of the MRO250 Batch-Oven. The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.
The Fritsch IRO850 Inline Reflow Oven ensures environmentally friendly lead-free soldering, accommodating a wide variety of components, including QFP and BGA/CSP. This reflow oven has a length of up to 850 mm and a pin chain working width ranging from 35 to 395 mm. The system is managed by user-friendly software that can be customized to meet the specific requirements of the soldering project.
Details
The reflow oven enables eco-friendly, lead-free soldering of complex boards with components such as QFP and BGA/CSP. It is ideal for small and medium series production.
The basic model features a heating chamber with eight heating zones, four on the top and four on the bottom. These zones use convective heat generated by hot air blowers.
The upper part of the heating chamber also includes a cooling zone and an exhaust air hood at the entry and exit points. A pin chain transports the boards through the soldering process.
The system is operated via a modern 7-inch touch panel. It includes a one-channel temperature sensor to monitor the soldering profile on the PCB. Additionally, a similar thermoelement sensor is provided as part of the standard package.
Product options
MRO250 Batch-solder systems
- easy handling
- precise results
- economic
- very flexible
IRO850 Inline reflow oven
- automatic recognition of component groups
- lead-free soldering
- exhaust air bonnet
As an option, we offer a transport grid for the inline reflow soldering oven. Its dimensions are 350 x 210 mm. It is useful for small format single-sided printed circuit boards.
Parameters
MRO250 Batch solder system
- Dimensions: 590 x 260 x 430 mm
- Max. PCB size: 350 x 250 mm
- Preheating-temperature / time: 50 – 240°C, 1 – 3600 sec.
- Reflow-temperature / time: 75 – 320°C, 1 – 600 sec.
- long-time process (e. g. b. cure adhesive): 50 – 180°C, 1 – 300 min.
Inline Reflow Oven IRO850
- Usable width of pin chain: 35 – 395 mm
- Oven length: 850 mm
- Infeed height: 45 mm
- Speed of transportation: 3 – 70 cm/min
Product showcase videos
Batch Solder System
The compact size and extremely good value of the Convection Reflow Soldering System makes Surface Mount Reflowing viable even for very small batch sizes.
Inline Reflow Oven IRO850
FRITSCH offers with the reflow solder system the optimal solution for the production of small up to medium series.
