Wave soldering
The first step in the wave soldering process is the application of the flux. The panel is then heat treated and placed in the solder bath where the solder material is applied in two waves.
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In wave soldering, the first step involves the application of flux onto the board. Subsequently, the board undergoes preheating at a moderate temperature, simultaneously drying the flux. The purpose of preheating is to protect the board from thermal shock in the solder bath. This step is crucial because sudden temperature spikes can cause board deformation and component damage. The preheated panel then enters the solder bath, where the solder material is applied in two waves: the first solder wave is narrower, turbulent, known as the chip wave, primarily aimed at overcoming shadowing effects behind chip components, and the second wave is broader, laminar, aimed at removing short circuits between leads and excess solder.