Yamaha VP-01G-Y
3D solder paste inspection station
Introduction
The Yamaha VP-01G-Y 3D Paste Inspection Station is an indispensable element of Yamaha’s complete production line solution. With its Moire technology imaging system, it can measure parameters at dynamically adjustable resolutions at the speed of the production line, and detect adhesive or foreign materials on the surface of the PCB. Combining 2D and 3D imaging systems with a special algorithm, it can measure the lowest paste height, even from 15 μm thickness. Through M2M communication, it synchronizes with other equipment on the line, and can automatically switch programs as needed, send paste offset feedback to the SPI, trigger stencil cleaning, or transmit Barcode or Badmark information to subsequent machines.
Details
- 24” monitor
- Offline programming station
- Win 10
- PCB warpage compensation
- 3D solder printing inspection
- Foreign material inspection
- 3D glue inspection
- Dynamic resolution
- High-precision 2D contour extraction
- Highly accurate 3D inspections by applying a unique 3-step algorithm
- Supports high-speed and high-resolution inspections in one machine
- Automatic changeover
- Print feedback
- Feed forward badmark and program
- Program creation from dispenser
Product options
- Twin projector
- IPC-CFX protocol
Parameters
- Applicable PCB L 510 mm × W 510 mm to L 50 mm × W 50 mm; Thickness 0.3 to 5.0 mm
- Horizontal resolution (FOV size)
1) 25 μm / 12.5 μm (approx. 50 × 50 mm)
2) 20 μm / 10 μm (approx. 40 × 40 mm)
3) 15 μm / 7.5 μm (approx. 30 × 30 mm)
*All are standard selection type - Twin Projector
- Inspection speed Standard (High Resolution)
- Resolution 25 (12.5) μm 8,900 (5,600) mm2/s
- Resolution 20 (10) μm 5,700 (3,500) mm2/s
- Resolution 15 (7.5) μm 3,200 (1,900) mm2/s
- Accuracy Volume 3 σ With in 2%
- Single Projector
- Inspection speed Standard (High Resolution)
- Resolution 25 (12.5) μm 9,400 (6,000) mm2/s
- Resolution 20 (10) μm 6,000 (3,700) mm2/s
- Resolution 15 (7.5) μm 3,300 (2,000) mm2/s
- Accuracy Volume 3 σ With in 3%
- Height resolution 1 μm
- Inspection items Solder paste printing quality (volume, height, area and misalignment)
- Power supply Single-phase AC 200/208/220/230/240 V ±10%
- Air supply source Pressure: 0.4 Mpa
- Consumption: 1.0 NL/min
- External dimension L 938 mm x W 1,191 mm x H 1,480 mm
- Weight Approx. 600 kg
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