Takaya APT-2600F

DUAL SIDE Flying Probe Test System

Introduction

The APT-2600F series is a high-performance dual-sided flying probe test system. Featuring four (4) measuring heads and six (6) probes on the top side, along with two (2) measuring heads and four (4) probes on the bottom, it enables simultaneous two-sided testing without the need to flip the panel. The measuring system and testing capabilities have been significantly enhanced, just as in the single-sided version, to achieve greater test coverage, facilitating the detection of manufacturing defects in PCBA boards.

We offer various models designed for testing large-size (XL) PCBs and for automated testing.

The APT-2600FD series reduces testing costs from prototype manufacturing to mass production while improving assembly quality.

The Takaya flying probe system is a technological and market leader in bed-of-nails-free solutions, offering Japanese quality. This technology is particularly favored for testing products manufactured in small to medium production runs.

Examples of applications, without mentioning all:

  • prototype production,
  • first product testing
  • test products wit no test points available,
  • testing products has frequent revision changes,
  • complex products where test coverage is crucial,
  • when no time for waiting fixture lead time,
  • as an additional test for complex, complicated products
  • for complex products where the cost of manufacturing the needle bed is very high and its long-term reliability is questionable

Details

  • Dual-Sided Flying Probe System
  • Simultaneous measurement with 6 probes from both side
  • 0.02~0.03sec/measurement speed
  • Smallest measurable solder pad < 50μm
  • Extended small and large resistance and capacitor measurement capability
  • Extended frequency measurement
  • RLCD, Circuit Dynamic Characteristics Measurement, Power ON Test, etc.
  • ICOPEN (Electrical test of IC pin soldering failure for BGA, QFP, SOJ, etc.)
  • Low Measurement Voltage
  • High precision gold plated probes
  • Zero Probe Impact Control
  • High speed resolution colour CCD camera with dynamic lens
  • Built-in AOI functions
  • Colour 3D Real Map
  • Automatic width adjustment

Product options

  • Combined test function, JTAG boundary scan
  • ISP function
  • Multi-Probe System (dedicated movable mini-fixture for component programming).
  • LED sensor (wavelength and intensity measurement)
  • UV/IR sensor
  • Remote camera (poka joke test)
  • Temperature sensor
  • Lateral illumination
  • Laser distance measurement
  • Automatic conveyor system (Inline design)
  • Testing of SL size panels
  • Extra-long product testing
  • MERLIN CAD conversion test program preparation SW
  • Automatic resulting calculation, netlink creation
  • Industry 4.0 Ready IPC-Hermes-9852; IPC-CFX protocol, OPC UA interface

Parameters

  • Maximum size of scalable panel: 540 x 483 mm
  • Equipment dimensions: 1400 x 1500 x 1400 mm (W x H x D)
  • Weight: 1350 kg

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