Mirtec MV-6 Omni

Optimal 3D AOI to improve productivity

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Introduction

With over two decades of expertise, Korea’s Mirtec has become a top provider of optical inspection solutions across industries, from automotive to consumer electronics. The Mirtec MV-6 OMNI series delivers exceptional 2D and full 3D inline optical inspection with unmatched efficiency, speed, and accuracy—at an affordable price point.

The MV-6 OMNI utilizes patented Blue DLP Moiré technology for precise, noise-free 3D measurements, even on reflective surfaces. Its 15 MP camera and 10 or 15 μm telecentric lens ensure lightning-fast, high-resolution inspection. Combining 3D and full 2D measurement capabilities, it detects defects that standalone 3D systems might miss, such as polarity marks, cracks, and solder imperfections. With its 8-phase illumination system, including coaxial lighting, even the finest details are flawlessly captured.

The system’s side camera adds another layer of precision, enabling inspection at angles perfect for detecting issues like solder joints on J-leg ICs, QFNs, and polarity marks.

Details

High speed, high performance full 3D + 2D AOI equipment
Blue Moire 3D noise- and shadow-free imaging
15 MP camera
Patented CoaXPress technology – faster image processing time
Improved 8-phase colour illumination
10 micron/pixel telecentric lens design
4 way – 12 projection high frequency shadowless Moire imaging for 3D scanning
Precision AC servo drive (X-Y)
Extremely easy programming and machine operation
Programming based on IPC standard
External software, SPC, programming, debugging module

Product Options

Exclusive 25 MP camera
Integrated 18 MP side camera system
Intelli-Scan laser height measurement
Intelli-Sys Total Quality Management Systems
Intelli-Tracker – SPI – AOI Total Quality Management
X-Y Linear motor drive
Dual lane design
Connection to MES and FIS
BC reading by camera
LED testing

Parameters

Testable panel size:

Min. 50 mm x 50 mm- max 510 mm x 460 mm
TOP clearence: 45 mm
Smallest inspectable component: 03015mm chip

Typical inspection items: missing part, misplaced part, tombstoning, Manhattan effect, polarity, up side down components, scratch, foreign object, solder ball, misalignment, rotation, lifted chip, pin or IC, THT parts and more.