Mirtec MV-3
Benchtop 3D AOI for small quantities
Introduction
The Mirtec MV-3 OMNI is a cost-effective, benchtop 3D AOI solution designed for inspecting small production runs or prototypes, whether for SMD or THT products. For budget-conscious inspection needs, the MV-3 series is also available in a 2D-only version.
Despite its compact design, the MV-3 OMNI leverages the same cutting-edge inspection technology as Mirtec’s inline systems. Equipped with a proprietary camera system and advanced imaging and processing techniques, it ensures reliable, high-quality inspection. Plus, with its incredibly simple, near-zero false call program generation, it offers unmatched ease of use.
Details
- 18 MP digital camera with telecentric lens
- Resolution optional 10 or 15μm/pixel
- Advanced 8-phase coaxial colour illumination
- Testable panels from 50 x 50 mm to 480 x 460 mm
- Precision AC servo drive
- Pre and post reflow testing option
- Extremely easy programming and machine operation
- External software, SPC, programming, debugging module
- Programming based on IPC standard
Product Options
- Optional 10 megapixel side cameras
- Intelli-Beam 3D laser height measurement with up to four (4) accurate measurements on BGA and CSP components
- Faulty component marking
- Manual or automatic barcode reading with camera
- Remote programming, debug and SPC software
Parameters
- Testable panels from 50 x 50mm to 660 x 510mm
- Bottom clearence: 50.8 mm
- Top clearence: 45 mm optional
- Smallest part to be tested: 01005 chipTypical defects to be tested: missing part, misplaced part, tombstoning, Manhattan effect, polarity, flipped part, scratch, foreign object, solder ball, misalignment, rotation, raised chip, foot or IC, drilled parts and etc.
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