Mirtec MS-11
High speed high precision affordable 3D SPI
Introduction
When pinpointing the root cause of PCBA manufacturing defects, solder paste printing often tops the list. Whether it’s smudging, insufficient or excess paste, misalignment, or missing areas, these defects can compromise the quality of your entire production line. The Mirtec MS-11 SPI machine is your first line of defense, detecting these issues before they disrupt the process.
Equipped with advanced Dual Moiré technology, the MS-11 delivers shadow-free image acquisition for crystal-clear inspection results. These images are analyzed instantly by a powerful image processing unit, ensuring rapid and precise defect detection. With its exceptional speed, the MS-11 will never slow down your production line.
Designed for simplicity and reliability, the MS-11 is easy to program with no need for advanced engineering skills, and it boasts a low cost of operation.
The system also features an integrated closed-loop solution, enabling real-time feedback to the paste printer or SMT mounters to automatically ensure high-quality production throughout the process.
Details
- High speed and high precision inline SPI equipment
- Advanced dual shadowless MOIRÉ imaging system
- 4 – 15 MP camera
- 10 microns/pixel resolution
- Telecentric lenses
- Patented CoaXPress technology – faster image processing time
- 2 micron accuracy (Z axis)
- Precision AC servo drive
- Extremely easy programming and machine operation
- Laser panel warpage compensation
Product Options
- External or camera barcode reading
- Remote SPC software
- Dual lane design
Parameters
- Panel size: min. 50 mm x 50 mm – max 510 mm x 460 mm
- Typical defects that can be tested: excess or lack of paste, offset printing, bridging, pasteheight, volume, etc.
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