MPM Edison II Act

High performance stencil printing

Introduction

The MPM Edison II Act is the MPM’s next generation innovative stencil printing platform breaks all records for both print accuracy and speed.The MPM Edison II ACT (Automated Changeover Technology) is based on the proven MPM Edison platform, which is the industry’s most accurate printer with automated features.

The machine is capable of wet print accuracy of up to +/- 15μm at 6σ. This makes the Edison II Act a market leading solution for high volume, high precision automotive or smart device manufacturing jobs.

This changeover is the most labor intensive and time consuming in the electronics manufacturing. Edison II ACT provides a simple and labor-free solution.

Details

  • 8 micron positioning accuracy
  • 15 micron print accuracy (wet print, >2 Cpk @ 6σ)
  • 15 seconds cycle time including printing
  • 39 mm thin digital up/down camera
  • Checking the fiducials while moving (Camera on the fly)
  • Ultra-fast vacuum wet and dry stencil wiping
  • Adjustable stencil width (23″ – 29″)
  • New ergonomic design with easy access to work space and front electric cabinet
  • Automated paste changeover with 3×1200 g cartridge

Product Options

  • ACT capabilities:
    • 2 squeegees
    • dedicated workholder
    • stencil
    • paste
    • inner verification
  • Edgeloc™ Y-directional panel attachment
  • Feedback of SPI offsets
  • PrinTrack – Complete traceability system
  • External intervention in printer operation via OpenApp software
  • Industry 4.0 compliant free source editable interface for connectivity to any MES system
  • EnclosedFlow printhead – less solder paste used
  • Paste height and paste temperature measurement
  • Three-conveyor staged configuration for shorter cycle times

Parameters

  • Panel size: min 50 x 50 mm max 450 x 350 mm
  • Panel thickness: 0.2 mm to 6.0 m
  • Maximum bottom part size: 25.4 mm
  • Printable area: 450 mm x 350 mm
  • Max print speed: 305 mm/sec
  • Max stencil size: 737 mm x 737 mm

Image gallery

Product showcase videos

Edgeloc side panel attachment

Edgeloc side panel attachment

EdgeLoc uses software-controlled pressure control for optimum panel gripping and automatically adapts to the thickness of the PCB.

Paste redispenser option

Paste redispenser option

In addition to automatic paste height measurement, an automatic paste dispenser is also available for the Edison.

Ultra thin positioning camera system

Ultra thin positioning camera system

The 'POE' (Power Over Ethernet) camera, which, even with its axis system, is only 39 mm wide and can capture a field of view (FOV) of up to 9.7 mm x 6.0 mm.

Edison at work

Edison at work

Outstanding print accuracy up to +/- 15 microns (wet print, u003e2 Cpk @ 6σ)

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