BJ935/39 and BJ955/95 thick wire wedge bonder
- Details
- Parameters
- 2 µm repeatability (3 sigma)
- Precise feedback bond-force control (wire: 0cN - 1400cN, tape: 0cN - 4000cN)
- Working area: 254 mm×244 mm×50 mm or 370 mm × 410 mm × 54 mm
- Ultrasonic bonding head (40kHz, 60kHz, 100kHz, up to 100W)
- Up to 3 wires per second
- Huzal: 100 µm(opc. 75 µm) - 500 µm (Al, Au, Cu)
- Tape: 0,075 mm × 0,75 mm - 0,3 mm × 2 mm
- Integrated pull test
- Frontcut or Backcut bond heads with active wire cutters.